Flux-core preforms
Dual-sided flux coating with 0.3%–3% solids content; activity levels H/M/L. Halogen-free, no-clean, and splash-free. Typical solder joint void rate: 4%–20%.
参数：双面涂覆助焊剂，含量 0.3%–3% 可选，活性分 H/M/L 三级；无卤免洗、无飞溅；焊接空洞率典型 4%–20% 用途：IGBT 与 QFN 封装；解决锡膏焊料量不足、残留多、空洞率高的问题 适用工序：芯片贴装