One-component heat-curable epoxy die attach adhesive with excellent thixotropy and storage stability. Suitable for dispensing and stencil printing. Provides high bond strength after curing to prevent component shifting, detachment, or floating.
Paste consisting of a uniformly mixed alloy solder powder and flux system in specified proportions
Composed of a tin alloy core and an additive uniformly infused into the core; available in leaded and lead-free variants.
Replaces IC package pins for electrical interconnection and mechanical mounting
Block or rod form; high chemical and mechanical stability. A foundational raw material for tin deep processing.
Tin-lead alloy, melting point typically 183°C; excellent plasticity, electrical conductivity, and thermal conductivity.
Composed of elements such as tin, copper, and silver; lead-free.