Bonding Wire Diameter Selection: φ10-80 μm — Application Scenarios and Rationale for Different Diameters in Wire Bonding
Wire bonding is the core process for interconnecting chips to external circuits in semiconductor packaging. Bonding wire diameters range from φ10μm to φ80μm, spanning nearly three orders of magnitude. Each variation in wire diameter directly affects solder joint size, bond force parameters, current-carrying capacity, and packaging density. Selection requires more than just choosing a wire; it demands a systematic match between package type, chip structure, and process window.
