Gold-based high-temperature solder foils (AuSn/AuGe/AuSi)
Eutectic alloys such as AuSn80, AuGe12, and AuSi3.2 are customized with the AuCu series; eutectic temperature 280–363°C
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Lead-free Low-Temperature Solder Paste (Sn/In/Bi Series)
Sn100, SAC series, SnSb series lead-free alloys and In/Bi low-temperature solder foils; melting point 60–250°C selectable by segment; RoHS compliant; available in rectangular, disc, and tape-and-reel packaging.
Preformed solder wafers
Standard shapes (rectangular, washer, disc, frame, U-shaped) and custom options; 50+ alloy choices; flux-coated, tape-and-reel, and glass bottle packaging available.
Flux-core preforms
Dual-sided flux coating with 0.3%–3% solids content; activity levels H/M/L. Halogen-free, no-clean, and splash-free. Typical solder joint void rate: 4%–20%.