High-Purity Gold (Au1)
Purity ≥99.999%, available in flake and cylinder forms. Custom specifications supported.
Product
Splashed Gold (Au01)
Purity ≥99.999%, with extremely low C, N, and O impurities; features low and stable contact resistance, easy film formation, excellent fusion capability, and strong adhesion to the semiconductor substrate.
High-Purity Silver (Ag01)
Purity ≥ 99.999%
Platinum (Pt1)
Purity ≥ 99.99%
High-Purity Aluminum (Al01)
Purity options: 4N / 5N / 5N5
High-purity Titanium (Ti01)
Purity options: 4N / 4N5 / 5N
High-purity Nickel (Ni01)
Purity options: 4N / 4N5
High-Purity Copper (Cu01)
Purity ≥ 99.999%
Gold-zinc alloy (AuZn5)
Zn 5±0.5%, Au balance; thickness (0.05–2)±0.1 mm, length (4–10)±0.2 mm; per GB/T 15072
Sputtering Target Series
High-purity gold target, gold target, Au-Ge-Ni alloy target, platinum target, nickel target, titanium target, copper target, tantalum target, Ni-Cr alloy target, W-Ti alloy target; composition and dimensions customizable
Gold alloy wire (G2/GK/GJ)
Purity 99.99%, wire diameter φ10–80 μm
Gold alloy bonding wire
H1 (Au 80±0.5%) and H3 (Au 60±0.5%) compositions
Silver alloy bonding wire (502/503/504/506)
Silver content: 99%–88%; wire diameter: φ18–30 μm
Gold-Silver Alloy Bonding Wire (AW2/AW4/AW7)
Ag 62%–95%, Au ~4%; resistivity 2.3–3.5 μΩ·cm
Bonded Copper Wire (C01/C02)
Copper content ≥99.99%, wire diameter φ18–30 μm, resistivity 1.70 μΩ·cm
Palladium-plated copper wire
Dense, uniform palladium-plated copper wire surface; high tensile strength, low arc radius, high modulus, and corrosion resistance.
Probe base material
Palladium-based multi-component alloy; excellent conductivity, low contact resistance, higher hardness than beryllium copper, good elasticity, and long rolling life; probe tips can be machined via electrical discharge or chemical etching.
Gold-based high-temperature solder foils (AuSn/AuGe/AuSi)
Eutectic alloys such as AuSn80, AuGe12, and AuSi3.2 are customized with the AuCu series; eutectic temperature 280–363°C
Lead-free Low-Temperature Solder Paste (Sn/In/Bi Series)
Sn100, SAC series, SnSb series lead-free alloys and In/Bi low-temperature solder foils; melting point 60–250°C selectable by segment; RoHS compliant; available in rectangular, disc, and tape-and-reel packaging.
Preformed solder wafers
Standard shapes (rectangular, washer, disc, frame, U-shaped) and custom options; 50+ alloy choices; flux-coated, tape-and-reel, and glass bottle packaging available.
Flux-core preforms
Dual-sided flux coating with 0.3%–3% solids content; activity levels H/M/L. Halogen-free, no-clean, and splash-free. Typical solder joint void rate: 4%–20%.
Gold-tin alloy (AuSn20 / AuSn25)
Solder paste, diameter 4±0.2 mm, melting point approximately 280℃; ingot structure is dense and uniform.
Gold-Germanium-Nickel Alloy (AuGeNi 11.5-2 / 12-4 / 11-4.5)
Eutectic solder alloy available in granular and flake forms; composition analyzed via ICP-AES, fire assay, and titration; complies with GB/T 11066.
SMT Epoxy Surface Mount Red Adhesive (YT Series)
One-component heat-curable epoxy die attach adhesive with excellent thixotropy and storage stability. Suitable for dispensing and stencil printing. Provides high bond strength after curing to prevent component shifting, detachment, or floating.