Gold-based high-temperature solder foils (AuSn/AuGe/AuSi)
Eutectic alloys such as AuSn80, AuGe12, and AuSi3.2 are customized with the AuCu series; eutectic temperature 280–363°C
参数：AuSn80、AuGe12、AuSi3.2 等共晶合金与 AuCu 系定制；共晶温度 280–363℃ 用途：芯片共晶贴装、陶瓷管壳封帽、激光器与射频器件封装；支持环形与定制形状 适用工序：芯片贴装 / 封帽