Splashed Gold (Au01)
Purity ≥99.999%, with extremely low C, N, and O impurities; features low and stable contact resistance, easy film formation, excellent fusion capability, and strong adhesion to the semiconductor substrate.
参数：纯度 ≥99.999%，C、N、O 杂质含量极低，接触电阻低且稳定，成膜易、易融合、与半导体基体附着性好 用途：高端集成电路芯片制备 适用工序：蒸镀