Lead-free Low-Temperature Solder Paste (Sn/In/Bi Series)
Sn100, SAC series, SnSb series lead-free alloys and In/Bi low-temperature solder foils; melting point 60–250°C selectable by segment; RoHS compliant; available in rectangular, disc, and tape-and-reel packaging.
参数：Sn100、SAC 系、SnSb 系无铅合金与 In、Bi 系低温焊片；熔点 60–250℃ 分段可选；符合 RoHS；支持矩形、圆片与载带包装 用途：温敏器件封装、光电器件、阶梯焊接低温段 适用工序：芯片贴装