Lead-containing solder wire
Tin-lead alloy, melting point typically 183°C; excellent plasticity, electrical conductivity, and thermal conductivity.
参数：锡铅合金，熔点通常 183℃；可塑性、电导率、导热性能良好 用途：电子、电器、汽车等行业焊接 适用工序：波峰焊 / 浸焊
Tin-lead alloy, melting point typically 183°C; excellent plasticity, electrical conductivity, and thermal conductivity.
参数：锡铅合金，熔点通常 183℃；可塑性、电导率、导热性能良好 用途：电子、电器、汽车等行业焊接 适用工序：波峰焊 / 浸焊