Solder paste
Paste consisting of a uniformly mixed alloy solder powder and flux system in specified proportions
参数：合金焊料粉末与助焊剂系统按比例均匀混合的膏状体 用途：SMT 产线 PCB 上电阻、电容、IC 等元器件的焊接 适用工序：SMT 印刷
Paste consisting of a uniformly mixed alloy solder powder and flux system in specified proportions
参数：合金焊料粉末与助焊剂系统按比例均匀混合的膏状体 用途：SMT 产线 PCB 上电阻、电容、IC 等元器件的焊接 适用工序：SMT 印刷