Preformed solder wafers
Standard shapes (rectangular, washer, disc, frame, U-shaped) and custom options; 50+ alloy choices; flux-coated, tape-and-reel, and glass bottle packaging available.
参数：矩形、垫圈形、圆片、方框、U 形等标准形状与定制；50 余种合金可选；支持助焊剂涂层与载带、玻璃瓶包装 用途：IGBT、QFN、DIP 等半导体封装；焊料量精准、空洞率低 适用工序：芯片贴装 / 封装