Optical Communication

Optical Communication and Laser Device Packaging

Sealing and packaging for optical communication and laser devices, featuring a compact package structure that utilizes preformed solder pads and high-purity gold to accommodate miniaturized components.

01 · PAIN POINT

Process Pain Points

Optoelectronic component packaging cavities are compact and highly sensitive to hermeticity and solder volume. Excess solder may overflow, while insufficient solder can compromise the seal.

02 · SOLUTION

Material Proposal

Pre-formed solder preforms are shaped to match device dimensions for precise solder volume control per unit. High-purity gold and similar materials are used for critical connections and plating, supporting miniaturized packaging structures.

03 · KEY METRICS

Key Parameters

Solder Pad Specifications: Customize by device size
Material System: Gold alloy / Gold-silver alloy
Supply Mode: Tape and Reel Packaging

DETAILS

App Description

Optical communication and laser device packaging chambers are compact, making them sensitive to hermeticity and solder volume control. Excess solder may overflow, while insufficient solder compromises the seal.

Pre-formed solder pads are shaped to match device dimensions, ensuring precise solder volume per component. Combined with flux coating and tape-and-reel packaging, they enable seamless automation on production lines.

High-purity gold and other materials are used for critical connections and plating. Each batch includes test data and retained samples to support traceability for device manufacturers.

Provide component dimensions, package structure, and process details to match solder pad specifications and material combination recommendations.

Recommended Materials

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Preformed solder wafers High-Purity Gold Au1 High-Purity Silver Ag01

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Inquiry

Need a material proposal for the optical communication process?

Provide process steps and key parameter requirements. Submit a list of selectable materials with specification recommendations by the end of the day.

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